SAA3028N vs MC145026P feature comparison

SAA3028N NXP Semiconductors

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MC145026P Motorola Mobility LLC

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SUPPORT CIRCUIT TRANSMITTER IC
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm 4.44 mm
Supply Voltage-Max (Vsup) 5.5 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 2.5 V
Surface Mount NO NO
Temperature Grade OTHER INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Transmission Media I2C
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
JESD-609 Code e0
Length 19.175 mm
Package Equivalence Code DIP16,.3
Technology CMOS
Terminal Finish TIN LEAD

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