SAA5244AP
vs
SAA9042
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
DIP, DIP40,.6
|
Pin Count |
40
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
TELETEXT DECODER
|
|
Crystal Frequency-Nom |
27 MHz
|
|
External Page Memory Support |
NO
|
|
JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
JESD-609 Code |
e3/e4
|
e0
|
Length |
52 mm
|
|
Number of Functions |
1
|
|
Number of Internal Stored Pages |
1
|
|
Number of Languages |
5
|
|
Number of Lines per Frame |
625
|
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.7 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Surface Mount |
NO
|
NO
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN/NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Video Input Processor |
YES
|
|
Width |
15.24 mm
|
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
Package Equivalence Code |
|
DIP40,.6
|
Technology |
|
CMOS
|
|
|
|
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