SBFX8160-10
vs
SBFX8160-12
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP, QFP208,1.2SQ,20
|
LFQFP, QFP208,1.2SQ,20
|
| Pin Count |
176
|
176
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
160 MACROCELLS; 16 CONFIGURABLE FUNCTION BLOCKS
|
160 MACROCELLS; 16 CONFIGURABLE FUNCTION BLOCKS
|
| Clock Frequency-Max |
71.4 MHz
|
58.8 MHz
|
| JESD-30 Code |
S-PQFP-G176
|
S-PQFP-G176
|
| JESD-609 Code |
e0
|
e0
|
| Length |
24 mm
|
24 mm
|
| Number of Dedicated Inputs |
48
|
48
|
| Number of I/O Lines |
120
|
120
|
| Number of Inputs |
168
|
168
|
| Number of Logic Cells |
160
|
160
|
| Number of Outputs |
120
|
120
|
| Number of Terminals |
176
|
176
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
48 DEDICATED INPUTS, 120 I/O
|
48 DEDICATED INPUTS, 120 I/O
|
| Output Function |
REGISTERED
|
REGISTERED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
12 ns
|
14 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24 mm
|
24 mm
|
| Base Number Matches |
1
|
1
|
|
|
|