SC16C550BIBS vs 935274387529 feature comparison

SC16C550BIBS NXP Semiconductors

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935274387529 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN
Package Description HVQCCN, LCC32,.2SQ,20 QCCJ,
Pin Count 32
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2.5V SUPPLY ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width 3 3
Boundary Scan NO NO
Clock Frequency-Max 48 MHz 48 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ NRZ
Data Transfer Rate-Max 0.375 MBps 0.375 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQCC-N32 S-PQCC-J44
JESD-609 Code e4 e3
Length 5 mm 16.585 mm
Low Power Mode NO NO
Moisture Sensitivity Level 1
Number of Serial I/Os 1 1
Number of Terminals 32 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN QCCJ
Package Equivalence Code LCC32,.2SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1 mm 4.57 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN
Terminal Form NO LEAD J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 5 mm 16.585 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1

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