SC16C550IA44,529
vs
TL16C550BFN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
LPCC
|
LCC
|
| Package Description |
QCCJ,
|
PLASTIC, LCC-44
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Additional Feature |
ALSO OPERATES AT 2.5V SUPPLY
|
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
48 MHz
|
3.072 MHz
|
| Communication Protocol |
ASYNC, BIT; SYNC, BYTE
|
ASYNC, BIT
|
| Data Transfer Rate-Max |
0.375 MBps
|
0.068603515625 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
| Length |
16.51 mm
|
16.5862 mm
|
| Low Power Mode |
YES
|
NO
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
16.51 mm
|
16.5862 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Data Encoding/Decoding Method |
|
NRZ
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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