SC16C754IA68,529
vs
XR16V654DIV-F
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MAXLINEAR INC
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCJ,
|
10 X 10 MM, 1.40 MM HEIGHT, GREEN, LQFP-64
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 2.5V SUPPLY
|
ALSO OPERATES AT 2.5V SUPPLY @ 50MHZ
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
80 MHz
|
64 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Transfer Rate-Max |
0.625 MBps
|
2 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G64
|
| Length |
24.2316 mm
|
10 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Serial I/Os |
4
|
4
|
| Number of Terminals |
68
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
1.6 mm
|
| Supply Voltage-Max |
3.63 V
|
3.63 V
|
| Supply Voltage-Min |
2.97 V
|
2.97 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.2316 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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