SC16IS760IBS,128
vs
SC16IS760IBS,151
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
QFN
|
Package Description |
4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24
|
4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24
|
Pin Count |
24
|
24
|
Manufacturer Package Code |
SOT616-3
|
SOT616-3
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
16 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
ALSO OPERATES AT 2.5V SUPPLY
|
ALSO OPERATES AT 2.5V SUPPLY
|
Address Bus Width |
2
|
2
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
80 MHz
|
80 MHz
|
Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
Data Transfer Rate-Max |
0.625 MBps
|
0.625 MBps
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-N24
|
S-PQCC-N24
|
JESD-609 Code |
e4
|
e4
|
Length |
4 mm
|
4 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
1
|
Number of Serial I/Os |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC24,.16SQ,20
|
LCC24,.16SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4 mm
|
4 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
1
|
1
|
|
|
|