SC16IS760IPW,128 vs SC16IS750IPW feature comparison

SC16IS760IPW,128 NXP Semiconductors

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SC16IS750IPW Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code TSSOP2
Package Description 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
Pin Count 24
Manufacturer Package Code SOT355-1
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO OPERATES AT 2.5V SUPPLY
Address Bus Width 2
Boundary Scan NO
Clock Frequency-Max 80 MHz
Communication Protocol ASYNC, BIT
Data Transfer Rate-Max 0.625 MBps
External Data Bus Width
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4
Length 7.8 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Serial I/Os 1
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP24,.25 TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 2

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