SC16IS760IPW
vs
935279279157
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
R-PDSO-G24
|
S-PQCC-N24
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP24,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.635 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
HVQCCN,
|
| Additional Feature |
|
CAN ALSO OPERATES AT 2.5 V SUPPLY
|
| Address Bus Width |
|
2
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
80 MHz
|
| Communication Protocol |
|
ASYNC, BIT
|
| Data Encoding/Decoding Method |
|
NRZ
|
| Data Transfer Rate-Max |
|
0.625 MBps
|
| External Data Bus Width |
|
|
| JESD-609 Code |
|
e4
|
| Length |
|
4 mm
|
| Low Power Mode |
|
YES
|
| Number of Serial I/Os |
|
1
|
| Seated Height-Max |
|
1 mm
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Width |
|
4 mm
|
|
|
|
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