SCH3227I-SZ
vs
SCH3227-SZ-TR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
WFBGA-144
|
WFBGA-144
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
7 Weeks
|
7 Weeks
|
Date Of Intro |
2016-03-03
|
2016-03-03
|
Samacsys Manufacturer |
Microchip
|
|
Address Bus Width |
|
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
PCI; UART
|
PCI; UART
|
Clock Frequency-Max |
33 MHz
|
33 MHz
|
Communication Protocol |
SYNC, BYTE
|
SYNC, BYTE
|
Data Transfer Rate-Max |
0.1875 MBps
|
0.1875 MBps
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
JESD-609 Code |
e1
|
e1
|
Length |
9 mm
|
9 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
4
|
4
|
Number of I/O Lines |
40
|
40
|
Number of Serial I/Os |
6
|
6
|
Number of Terminals |
144
|
144
|
On Chip Data RAM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA144,13x13,25
|
BGA144,13x13,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
RAM (words) |
256
|
256
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Current-Max |
1 mA
|
1 mA
|
Supply Voltage-Max |
3.63 V
|
3.63 V
|
Supply Voltage-Min |
2.97 V
|
2.97 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
9 mm
|
9 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
2
|
1
|
|
|
|