SCT3080KLHRC11
vs
S2301
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Package Description |
FLANGE MOUNT, R-PSFM-T3
|
UNCASED CHIP, X-XXUC-N
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
2018-12-11
|
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
1200 V
|
1200 V
|
| Drain Current-Max (ID) |
31 A
|
40 A
|
| Drain-source On Resistance-Max |
0.104 Ω
|
0.111 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
35 pF
|
|
| JEDEC-95 Code |
TO-247
|
|
| JESD-30 Code |
R-PSFM-T3
|
X-XXUC-N
|
| JESD-609 Code |
e3
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
175 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
FLANGE MOUNT
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
265
|
NOT SPECIFIED
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation-Max (Abs) |
165 W
|
|
| Pulsed Drain Current-Max (IDM) |
77 A
|
80 A
|
| Reference Standard |
AEC-Q101
|
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Position |
SINGLE
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
NOT SPECIFIED
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON CARBIDE
|
SILICON CARBIDE
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SCT3080KLHRC11 with alternatives
Compare S2301 with alternatives