SDED7-256M-N9Y
vs
MD2534-D1G-X-P/Y
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SANDISK CORP
|
SANDISK CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
12 X 9 MM, 1.20 MM HEIGHT, FBGA-115
|
TFBGA,
|
| Pin Count |
115
|
115
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
IT ALSO REQUIRES 3.3V I/O SUPPLY
|
IT ALSO REQUIRES 3.3V I/O SUPPLY
|
| JESD-30 Code |
R-PBGA-B115
|
R-PBGA-B115
|
| Length |
12 mm
|
12 mm
|
| Number of Terminals |
115
|
115
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.95 V
|
1.95 V
|
| Supply Voltage-Min |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
|
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SDED7-256M-N9Y with alternatives
Compare MD2534-D1G-X-P/Y with alternatives