SE555CN-14 vs LMC555CN feature comparison

SE555CN-14 Signetics

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LMC555CN National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIGNETICS CORP NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP14,.3 DIP-8
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDIP-T8
JESD-609 Code e0 e0
Number of Terminals 14 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Analog IC - Other Type PULSE; RECTANGULAR
Length 9.817 mm
Moisture Sensitivity Level 1
Number of Functions 1
Output Frequency-Max 3 MHz
Peak Reflow Temperature (Cel) 260
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 12 V
Supply Voltage-Min (Vsup) 1.5 V
Supply Voltage-Nom (Vsup) 5 V
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm

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