SG117HVG/883B vs LM117HMW8 feature comparison

SG117HVG/883B Microsemi Corporation

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LM117HMW8 Texas Instruments

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SILICON GENERAL INC NATIONAL SEMICONDUCTOR CORP
Part Package Code TO-257 WAFER
Package Description , DIE, WAFER
Pin Count 3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XSFM-T3 X-XUUC-N
Number of Functions 1 1
Number of Terminals 3
Operating Temperature TJ-Max 150 °C 150 °C
Operating Temperature TJ-Min -55 °C -55 °C
Output Current1-Max 1.5 A 1.5 A
Output Voltage1-Max 57 V 37 V
Output Voltage1-Min 1.2 V 1.2 V
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR UNSPECIFIED
Package Style FLANGE MOUNT UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Regulator Type ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position SINGLE UPPER
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Adjustability ADJUSTABLE
Dropout Voltage1-Nom 3 V
Line Regulation-Max (%/V) 0.05
Load Regulation-Max(%) 1%
Moisture Sensitivity Level 1
Number of Outputs 1
Package Code DIE
Package Equivalence Code WAFER
Peak Reflow Temperature (Cel) 260
Screening Level 38535Q/M;38534H;883B
Time@Peak Reflow Temperature-Max (s) 40

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