SG150AG/883B
vs
LM217H
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LINFINITY MICROELECTRONICS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
, SIP3,.1TB
|
, CAN3/4,.2
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Adjustability |
ADJUSTABLE
|
ADJUSTABLE
|
| Dropout Voltage1-Nom |
3 V
|
|
| JESD-609 Code |
e0
|
e0
|
| Line Regulation-Max (%/V) |
0.05
|
|
| Load Regulation-Max(%) |
1%
|
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature TJ-Max |
150 °C
|
150 °C
|
| Operating Temperature TJ-Min |
-55 °C
|
-25 °C
|
| Output Current1-Max |
3 A
|
0.5 A
|
| Output Voltage1-Max |
33 V
|
37 V
|
| Output Voltage1-Min |
1.2 V
|
1.2 V
|
| Package Body Material |
METAL
|
METAL
|
| Package Equivalence Code |
SIP3,.1TB
|
CAN3/4,.2
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Surface Mount |
NO
|
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
SINGLE
|
BOTTOM
|
| Base Number Matches |
2
|
6
|
| JESD-30 Code |
|
O-MBCY-W3
|
| Package Shape |
|
ROUND
|
| Package Style |
|
CYLINDRICAL
|
| Terminal Form |
|
WIRE
|
|
|
|
Compare SG150AG/883B with alternatives