SG150IG/883B vs LM317KMDC feature comparison

SG150IG/883B Microsemi Corporation

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LM317KMDC Texas Instruments

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SILICON GENERAL INC NATIONAL SEMICONDUCTOR CORP
Part Package Code TO-257 DIE
Package Description , DIE, DIE OR CHIP
Pin Count 3
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XSFM-T3 X-XUUC-N
Number of Functions 1 1
Number of Terminals 3
Operating Temperature TJ-Max 150 °C 125 °C
Operating Temperature TJ-Min -55 °C
Output Current1-Max 3 A 1.5 A
Output Voltage1-Max 33 V 37 V
Output Voltage1-Min 1.2 V 1.2 V
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR UNSPECIFIED
Package Style FLANGE MOUNT UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Regulator Type ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Surface Mount NO YES
Terminal Form THROUGH-HOLE NO LEAD
Terminal Position SINGLE UPPER
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Adjustability ADJUSTABLE
Dropout Voltage1-Nom 3 V
Line Regulation-Max (%/V) 0.07
Load Regulation-Max(%) 1.5%
Moisture Sensitivity Level 1
Number of Outputs 1
Package Code DIE
Package Equivalence Code DIE OR CHIP
Peak Reflow Temperature (Cel) 260
Technology BIPOLAR
Time@Peak Reflow Temperature-Max (s) 40

Compare SG150IG/883B with alternatives

Compare LM317KMDC with alternatives