SG1526BJ vs SG3526BN feature comparison

SG1526BJ Microsemi Corporation

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SG3526BN Microsemi Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DIP DIP
Package Description HERMETIC SEALED, CERAMIC, DIP-18 DIP, DIP18,.3
Pin Count 18 18
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SWITCHING CONTROLLER SWITCHING CONTROLLER
Control Mode VOLTAGE-MODE VOLTAGE-MODE
Control Technique PULSE WIDTH MODULATION PULSE WIDTH MODULATION
Input Voltage-Max 35 V 35 V
Input Voltage-Min 8 V 8 V
Input Voltage-Nom 15 V 15 V
JESD-30 Code R-GDIP-T18 R-PDIP-T18
JESD-609 Code e0 e3
Number of Functions 1 1
Number of Terminals 18 18
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Current-Max 0.2 A 0.2 A
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Surface Mount NO NO
Switcher Configuration PUSH-PULL PUSH-PULL
Switching Frequency-Max 500 kHz 500 kHz
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 5 1
Samacsys Manufacturer Microsemi Corporation
Length 22.86 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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