SG1626Y vs LM5109AMA feature comparison

SG1626Y Microsemi Corporation

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LM5109AMA National Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP8,.3 MS-012AA, SOIC-8
Pin Count 8
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
High Side Driver NO YES
Interface IC Type BUFFER OR INVERTER BASED MOSFET DRIVER HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code R-GDIP-T8 R-PDSO-G8
JESD-609 Code e0 e0
Length 10.415 mm 4.9 mm
Number of Functions 2 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Peak Current Limit-Nom 3 A 1 A
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max 20 V 14 V
Supply Voltage-Min 4.5 V 8 V
Supply Voltage-Nom 15 V 12 V
Surface Mount NO YES
Technology BIPOLAR
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Turn-off Time 0.04 µs 0.056 µs
Turn-on Time 0.05 µs 0.056 µs
Width 7.62 mm 3.9 mm
Base Number Matches 3 2
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 235
Time@Peak Reflow Temperature-Max (s) 30

Compare SG1626Y with alternatives

Compare LM5109AMA with alternatives