SG2525AP
vs
UC2525BQ
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
UNITRODE CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SO-16
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
35 V
|
35 V
|
| Input Voltage-Min |
8 V
|
8 V
|
| Input Voltage-Nom |
20 V
|
20 V
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J20
|
| JESD-609 Code |
e4
|
e0
|
| Length |
9.9 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Output Current-Max |
0.5 A
|
0.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Equivalence Code |
SO16(UNSPEC)
|
LDCC20,.4SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
| Switching Frequency-Max |
500 kHz
|
500 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
2
|
| Supply Current-Max (Isup) |
|
20 mA
|
|
|
|
Compare SG2525AP with alternatives
Compare UC2525BQ with alternatives