SGTL5000XNAA3
vs
SGTL5000XNAA3/R2
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
QFN-32
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
ALSO OPERATE WITH 1.1V TO 2V DIGITAL SUPPLY
|
|
Analog Input-Max |
2.83 V
|
|
Filter |
YES
|
YES
|
Input Type |
SINGLE-ENDED
|
|
JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
JESD-609 Code |
e3
|
e3
|
Length |
5 mm
|
5 mm
|
Linear Coding |
NOT AVAILABLE
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
VOLTAGE
|
VOLTAGE
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC32,.2SQ,20
|
LCC32,.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Supply Voltage-Nom |
1.8 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
PCM CODEC
|
PROGRAMMABLE CODEC
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
3
|
2
|
|
|
|
Compare SGTL5000XNAA3 with alternatives
Compare SGTL5000XNAA3/R2 with alternatives