SI4032-B1-FMR
vs
M708B1
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
STMICROELECTRONICS
|
Part Package Code |
QFN
|
DIP
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Silicon Labs
|
|
Consumer IC Type |
TRANSMITTER IC
|
TRANSMITTER IC
|
JESD-30 Code |
S-XQCC-N20
|
R-PDIP-T20
|
Length |
4 mm
|
25.5 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
DIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
0.9 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
10.5 V
|
Supply Voltage-Min (Vsup) |
1.8 V
|
4.5 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
0.5 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Transmission Media |
RF
|
INFRARED
|
Width |
4 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Package Description |
|
PLASTIC, DIP-20
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
DIP20,.3
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare SI4032-B1-FMR with alternatives
Compare M708B1 with alternatives