SI4032-B1-FMR
vs
SAA3009P
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Silicon Labs
|
|
| Consumer IC Type |
TRANSMITTER IC
|
RECEIVER IC
|
| JESD-30 Code |
S-XQCC-N20
|
R-PDIP-T20
|
| Length |
4 mm
|
26.73 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.9 mm
|
4.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
4.5 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Transmission Media |
RF
|
INFRARED
|
| Width |
4 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
DIP,
|
| Package Equivalence Code |
|
DIP20,.3
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare SI4032-B1-FMR with alternatives
Compare SAA3009P with alternatives