SI4702-C19-GM
vs
TDA5731MDK
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
|
Package Description |
3 X 3 MM, ROHS COMPLIANT, QFN-20
|
LSSOP,
|
Pin Count |
20
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Silicon Labs
|
|
Built-in IF Amplifier |
YES
|
YES
|
Consumer IC Type |
AUDIO TUNER
|
VIDEO TUNER
|
Input Frequency-Max (RF) |
108 MHz
|
860 MHz
|
Input Frequency-Min (RF) |
76 MHz
|
42 MHz
|
JESD-30 Code |
S-XQCC-N20
|
R-PDSO-G20
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
6.5 mm
|
Moisture Sensitivity Level |
3
|
|
Noise Figure-Nom |
58 dB
|
9 dB
|
Number of Bands |
2
|
3
|
Number of Functions |
1
|
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
80 °C
|
Operating Temperature-Min |
-20 °C
|
-10 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
LSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.6 mm
|
1.5 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
3 mm
|
4.4 mm
|
Base Number Matches |
2
|
2
|
Supply Current-Max |
|
44 mA
|
|
|
|
Compare SI4702-C19-GM with alternatives
Compare TDA5731MDK with alternatives