SIR872ADP-T1-GE3
vs
IRHNA67164SCS
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
INFINEON TECHNOLOGIES AG
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, POWERPAK, SOP-8
|
CHIP CARRIER, R-CBCC-N3
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
44 Weeks
|
|
| Samacsys Manufacturer |
Vishay
|
Infineon
|
| Avalanche Energy Rating (Eas) |
45 mJ
|
283 mJ
|
| Case Connection |
DRAIN
|
DRAIN
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
150 V
|
150 V
|
| Drain Current-Max (ID) |
53.7 A
|
56 A
|
| Drain-source On Resistance-Max |
0.018 Ω
|
0.018 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PDSO-C5
|
R-CBCC-N3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
5
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Pulsed Drain Current-Max (IDM) |
100 A
|
224 A
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
C BEND
|
NO LEAD
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| Reference Standard |
|
RH - 100K Rad(Si)
|
|
|
|