SK2111AXFT
vs
PTN2111BD
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SEMTECH CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
HLQFP, QFP32,.35SQ,32
|
LQFP, QFP32,.35SQ,32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e0
|
|
| Length |
7 mm
|
7 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
32
|
32
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLQFP
|
LQFP
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
QFP32,.35SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
0.6 ns
|
2 ns
|
| Propagation Delay (tpd) |
0.58 ns
|
2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7 mm
|
7 mm
|
| fmax-Min |
800 MHz
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare SK2111AXFT with alternatives
Compare PTN2111BD with alternatives