SLE5542D vs SLE5532C feature comparison

SLE5542D Infineon Technologies AG

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SLE5532C Infineon Technologies AG

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Part Life Cycle Code Active Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG INFINEON TECHNOLOGIES AG
Part Package Code DIE DIE
Package Description DIE DIE
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Data Retention Time-Min 10 10
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-XUUC-N R-XUUC-N
Memory Density 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 80 °C 80 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X8 256X8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Equivalence Code DIE OR CHIP DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial SERIAL SERIAL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Write Cycle Time-Max (tWC) 5 ms 5 ms
Write Protection SOFTWARE SOFTWARE
Base Number Matches 1 1

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