SMP18FSZ-REEL vs SMP18FPZ feature comparison

SMP18FSZ-REEL Analog Devices Inc

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SMP18FPZ Analog Devices Inc

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Pbfree Code No No
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code SOIC DIP
Package Description SOIC-16 PLASTIC, DIP-16
Pin Count 16 16
Manufacturer Package Code R-16 N-16
Reach Compliance Code compliant compliant
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer Analog Devices
Acquisition Time-Nom 3.5 µs 3.5 µs
Amplifier Type SAMPLE AND HOLD CIRCUIT SAMPLE AND HOLD CIRCUIT
Analog Input Voltage-Max 3 V 3 V
Analog Input Voltage-Min -3 V -3 V
Droop Rate-Max 0.04 V/s 0.04 V/s
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e3 e3
Length 9.9 mm 20.13 mm
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -8.5 V -8.5 V
Neg Supply Voltage-Nom (Vsup) -5 V -5 V
Number of Functions 8 8
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Sample and Hold / Track and Hold SAMPLE SAMPLE
Seated Height-Max 1.75 mm 5.33 mm
Supply Current-Max 9.5 mA 9.5 mA
Supply Voltage Limit-Max 8.5 V 8.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
ECCN Code EAR99

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