SMP60N06-18
vs
STP55NE06
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
STMICROELECTRONICS
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Case Connection |
DRAIN
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
60 V
|
60 V
|
Drain Current-Max (ID) |
60 A
|
55 A
|
Drain-source On Resistance-Max |
0.018 Ω
|
0.022 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-220AB
|
TO-220AB
|
JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
240 A
|
220 A
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
SINGLE
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
4
|
Rohs Code |
|
Yes
|
Part Package Code |
|
TO-220AB
|
Package Description |
|
FLANGE MOUNT, R-PSFM-T3
|
Pin Count |
|
3
|
Samacsys Manufacturer |
|
STMicroelectronics
|
Avalanche Energy Rating (Eas) |
|
200 mJ
|
JESD-609 Code |
|
e3
|
Operating Temperature-Max |
|
175 °C
|
Power Dissipation-Max (Abs) |
|
130 W
|
Terminal Finish |
|
MATTE TIN
|
Transistor Application |
|
SWITCHING
|
|
|
|
Compare SMP60N06-18 with alternatives
Compare STP55NE06 with alternatives