SMUN2113T1
vs
MUN2116T1
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
Part Package Code |
SC-59
|
|
Package Description |
PLASTIC, CASE 318D-04, SC-59, 3 PIN
|
SMALL OUTLINE, R-PDSO-G3
|
Pin Count |
3
|
|
Manufacturer Package Code |
CASE 318D-04
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
4 Weeks
|
|
Additional Feature |
BUILT-IN BIAS RESISTOR RATIO IS 1
|
BUILT-IN BIAS RESISTORS
|
Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
Collector-Emitter Voltage-Max |
50 V
|
50 V
|
Configuration |
SINGLE WITH BUILT-IN RESISTOR
|
SINGLE WITH BUILT-IN RESISTOR
|
DC Current Gain-Min (hFE) |
80
|
160
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
235
|
|
Polarity/Channel Type |
PNP
|
PNP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
1
|
HTS Code |
|
8541.21.00.95
|
Operating Temperature-Max |
|
150 °C
|
Power Dissipation Ambient-Max |
|
0.2 W
|
VCEsat-Max |
|
0.25 V
|
|
|
|
Compare SMUN2113T1 with alternatives
Compare MUN2116T1 with alternatives