SMUN5235DW1T1G
vs
MUN5235DW1T1
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
| Part Package Code |
SC-88/SC70-6/SOT-363 6 LEAD
|
|
| Package Description |
419B-02, SC-88, SC-70, 6PIN
|
SMALL OUTLINE, R-PDSO-G6
|
| Pin Count |
6
|
|
| Manufacturer Package Code |
419B-02
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
12 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
| Collector-Emitter Voltage-Max |
50 V
|
50 V
|
| Configuration |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
| DC Current Gain-Min (hFE) |
80
|
80
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation-Max (Abs) |
0.385 W
|
0.15 W
|
| Reference Standard |
AEC-Q101
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| VCEsat-Max |
0.25 V
|
0.25 V
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8541.21.00.95
|
| Additional Feature |
|
BUILT IN BIAS RESISTOR RATIO IS 21.3636
|
| Power Dissipation Ambient-Max |
|
0.15 W
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare SMUN5235DW1T1G with alternatives
Compare MUN5235DW1T1 with alternatives