SN54AHC157W
vs
74AHC157BQ
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DFP
|
QFN
|
| Package Description |
DFP,
|
HVQCCN, LCC16,.1X.14,20
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AHC
|
AHC/VHC/H/U/V
|
| JESD-30 Code |
R-GDFP-F16
|
R-PQCC-N16
|
| Length |
10.2 mm
|
3.5 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DFP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Propagation Delay (tpd) |
15 ns
|
21.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.03 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
6.73 mm
|
2.5 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e4
|
| Max I(ol) |
|
0.008 A
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
LCC16,.1X.14,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
11 ns
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SN54AHC157W with alternatives
Compare 74AHC157BQ with alternatives