SN54AS762FKR
vs
935270794157
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
QLCC
|
BGA
|
Package Description |
QCCN,
|
VFBGA,
|
Pin Count |
20
|
56
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ONE FUNCTION WITH INVERTED OUTPUTS
|
|
Family |
AS
|
LVT
|
JESD-30 Code |
S-CQCC-N20
|
R-PBGA-B56
|
Length |
8.89 mm
|
7 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Number of Bits |
4
|
1
|
Number of Functions |
2
|
16
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
56
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QCCN
|
VFBGA
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Power Supply Current-Max (ICC) |
87 mA
|
|
Propagation Delay (tpd) |
20 ns
|
4 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.03 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
TTL
|
BICMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
8.89 mm
|
4.5 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Manufacturer Package Code |
|
SOT-702-1
|
Package Equivalence Code |
|
BGA56,6X10,25
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare SN54AS762FKR with alternatives
Compare 935270794157 with alternatives