SN54GTL16622AHV
vs
SN74GTLPH306DGVR
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
SOIC
|
| Package Description |
QFF,
|
TVSOP-24
|
| Pin Count |
68
|
24
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
GTL/TVC
|
GTLP
|
| JESD-30 Code |
S-GQFP-F68
|
R-PDSO-G24
|
| Length |
12.51 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Number of Bits |
9
|
8
|
| Number of Functions |
2
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
68
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
OPEN-COLLECTOR/3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
QFF
|
TSSOP
|
| Package Equivalence Code |
QFL68,.5SQ,25
|
TSSOP24,.25,16
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Power Supply Current-Max (ICC) |
60 mA
|
20 mA
|
| Propagation Delay (tpd) |
6.1 ns
|
7.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.86 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
FLAT
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
12.51 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Control Type |
|
COMMON CONTROL
|
| Count Direction |
|
BIDIRECTIONAL
|
| JESD-609 Code |
|
e4
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
7.5 ns
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SN54GTL16622AHV with alternatives
Compare SN74GTLPH306DGVR with alternatives