SN54HC00J
vs
8403701CX
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
HERMETIC SEALED, CERAMIC, DIP-14
CERAMIC, DIP-14
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
LG-MAX
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
Length
19.94 mm
19.56 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT APPLICABLE
Propagation Delay (tpd)
135 ns
135 ns
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT APPLICABLE
Width
7.62 mm
7.62 mm
Base Number Matches
2
7
Moisture Sensitivity Level
NOT APPLICABLE
Qualification Status
Not Qualified
Compare SN54HC00J with alternatives
Compare 8403701CX with alternatives