SN54HC688W vs 74HC688D feature comparison

SN54HC688W Texas Instruments

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74HC688D NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DFP SOIC
Package Description DFP, PLASTIC, SO-20
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CASCADABLE CASCADABLE
Family HC/UH HC/UH
JESD-30 Code R-GDFP-F20 R-PDSO-G20
Length 13.09 mm 12.8 mm
Logic IC Type IDENTITY COMPARATOR IDENTITY COMPARATOR
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE
Propagation Delay (tpd) 313 ns 51 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 6.92 mm 7.5 mm
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
Samacsys Manufacturer NXP
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Package Equivalence Code SOP20,.4
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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