SN54LS375J vs M38510/31604BEX feature comparison

SN54LS375J Freescale Semiconductor

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M38510/31604BEX Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T16 R-GDIP-T16
JESD-609 Code e0
Logic IC Type D LATCH D LATCH
Max I(ol) 0.004 A
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5 V
Power Supply Current-Max (ICC) 12 mA
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 4
Part Package Code DIP
Pin Count 16
HTS Code 8542.39.00.01
Family LS
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 46 ns
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Trigger Type POSITIVE EDGE

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