SN55LBC173TDA2
vs
MC1489AML1
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ONSEMI
|
Package Description |
DIE
|
EIAJ, SOIC-14
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Input Characteristics |
DIFFERENTIAL
|
SCHMITT TRIGGER
|
Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
Interface Standard |
EIA-422-A; EIA-423-A; EIA-485; CCITT V.11
|
EIA-232-D
|
JESD-30 Code |
R-XUUC-N16
|
R-PDSO-G14
|
Length |
2.04 mm
|
6.2 mm
|
Number of Functions |
4
|
4
|
Number of Terminals |
16
|
14
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
SSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
SMALL OUTLINE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Receiver Number of Bits |
4
|
4
|
Supply Current-Max |
11 mA
|
26 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BIPOLAR
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Position |
UPPER
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
1.932 mm
|
5.3 mm
|
Base Number Matches |
1
|
3
|
Part Package Code |
|
SOIC
|
Pin Count |
|
14
|
Additional Feature |
|
RESPONSE CONTROL
|
JESD-609 Code |
|
e4
|
Operating Temperature-Max |
|
75 °C
|
Operating Temperature-Min |
|
|
Output Low Current-Max |
|
0.01 A
|
Package Equivalence Code |
|
SOP14,.3
|
Qualification Status |
|
Not Qualified
|
Receive Delay-Max |
|
50 ns
|
Seated Height-Max |
|
2 mm
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Temperature Grade |
|
COMMERCIAL EXTENDED
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Terminal Pitch |
|
0.65 mm
|
|
|
|
Compare SN55LBC173TDA2 with alternatives
Compare MC1489AML1 with alternatives