SN65HVD1040QDRQ1
vs
KSZ8001L
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
GREEN, PLASTIC, MS-012AA, SOIC-8
|
LEAD FREE, LQFP-48
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8517.70.00.00
|
| Samacsys Manufacturer |
Texas Instruments
|
Microchip
|
| Data Rate |
1000 Mbps
|
100000 Mbps
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQFP-G48
|
| JESD-609 Code |
e4
|
e3
|
| Length |
4.9 mm
|
7 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Channels |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
48
|
| Number of Transceivers |
1
|
1
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LFQFP
|
| Package Equivalence Code |
SOP8,.25
|
QFP48,.35SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.75 mm
|
1.6 mm
|
| Supply Current-Max |
0.07 mA
|
|
| Supply Voltage-Nom |
5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
7 mm
|
| Base Number Matches |
1
|
5
|
| Factory Lead Time |
|
32 Weeks, 4 Days
|
| Technology |
|
CMOS
|
|
|
|
Compare SN65HVD1040QDRQ1 with alternatives
Compare KSZ8001L with alternatives