SN65LBC175ADRG4
vs
AM26LS32BIN
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP16,.25
|
DIP, DIP16,.3
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Driver Number of Bits |
4
|
|
Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
|
Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
Interface Standard |
EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
JESD-609 Code |
e4
|
e0
|
Length |
9.9 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
4
|
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Low Current-Max |
0.008 A
|
0.024 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.25
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receive Delay-Max |
16 ns
|
26 ns
|
Receiver Number of Bits |
4
|
|
Seated Height-Max |
1.75 mm
|
|
Supply Current-Max |
20 mA
|
70 mA
|
Supply Voltage-Max |
5.25 V
|
|
Supply Voltage-Min |
4.75 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BICMOS
|
TTL
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
3
|
|
|
|
Compare SN65LBC175ADRG4 with alternatives