SN65LVDS314RSKR
vs
SN65LVDS314RSKT
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
HVQCCN, LCC64,.32SQ,16
|
QCCN, LCC64,.32SQ,16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Driver Number of Bits |
4
|
|
| High Level Input Current-Max |
0.00002 A
|
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
| JESD-609 Code |
e4
|
|
| Length |
8 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
4
|
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
QCCN
|
| Package Equivalence Code |
LCC64,.32SQ,16
|
LCC64,.32SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Current-Max |
102.3 mA
|
102.3 mA
|
| Supply Voltage-Max |
1.95 V
|
|
| Supply Voltage-Min |
1.65 V
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Supply Voltage1-Max |
1.95 V
|
|
| Supply Voltage1-Min |
1.65 V
|
|
| Supply Voltage1-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
8 mm
|
|
| Base Number Matches |
1
|
1
|
| Receive Delay-Max |
|
|
|
|
|
Compare SN65LVDS314RSKR with alternatives
Compare SN65LVDS314RSKT with alternatives