SN74AC11IDRG4Q1
vs
FMM364HG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
FUJITSU LTD
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
SOIC-14
|
DFP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Family |
AC
|
MM
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDFP-F14
|
| JESD-609 Code |
e4
|
|
| Length |
8.65 mm
|
10 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
AND GATE
|
OR/NOR GATE
|
| Max I(ol) |
0.024 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
3
|
1
|
| Number of Inputs |
3
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
0.02 mA
|
|
| Prop. Delay@Nom-Sup |
10 ns
|
|
| Propagation Delay (tpd) |
10 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.75 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
5.6 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare SN74AC11IDRG4Q1 with alternatives
Compare FMM364HG with alternatives