SN74ALS1010AFN-00
vs
N74F10N,602
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
Package Description |
QCCJ,
|
0.300 INCH, PLASTIC, MO-001AA, SOT27-1, DIP-14
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
ALS
|
F/FAST
|
JESD-30 Code |
S-PQCC-J20
|
R-PDIP-T14
|
Length |
8.9662 mm
|
19.025 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Number of Functions |
3
|
3
|
Number of Inputs |
3
|
3
|
Number of Terminals |
20
|
14
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Power Supply Current-Max (ICC) |
5.8 mA
|
7.7 mA
|
Propagation Delay (tpd) |
7 ns
|
6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
TTL
|
TTL
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
8.9662 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
14
|
Manufacturer Package Code |
|
SOT27-1
|
Factory Lead Time |
|
4 Weeks
|
JESD-609 Code |
|
e4
|
Max I(ol) |
|
0.02 A
|
Package Equivalence Code |
|
DIP14,.3
|
Packing Method |
|
TUBE
|
Prop. Delay@Nom-Sup |
|
6 ns
|
Schmitt Trigger |
|
NO
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare SN74ALS1010AFN-00 with alternatives
Compare N74F10N,602 with alternatives