SN74ALVCH245DGV
vs
CLXC8T245QRHLRQ1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP, TSSOP20,.25,16
|
HVQCCN, LCC24,.14X.2,60/20
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH DIRECTION CONTROL
|
|
| Family |
ALVC/VCX/A
|
LXC
|
| JESD-30 Code |
R-PDSO-G20
|
R-PQCC-N24
|
| Length |
5 mm
|
5.5 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP20,.25,16
|
LCC24,.14X.2,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Propagation Delay (tpd) |
6 ns
|
70 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.08 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
4.4 mm
|
3.5 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Date Of Intro |
|
2020-10-16
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Control Type |
|
COMMON CONTROL
|
| Count Direction |
|
BIDIRECTIONAL
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
15 pF
|
| Max I(ol) |
|
0.032 A
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR, 13 INCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
0.012 mA
|
| Prop. Delay@Nom-Sup |
|
70 ns
|
| Schmitt Trigger |
|
YES
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SN74ALVCH245DGV with alternatives
Compare CLXC8T245QRHLRQ1 with alternatives