SN74AS760DW vs 74LVT16244BEV,157 feature comparison

SN74AS760DW Rochester Electronics LLC

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74LVT16244BEV,157 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code SOIC BGA
Package Description SOP, VFBGA, BGA56,6X10,25
Pin Count 20 56
Reach Compliance Code unknown not_compliant
Family AS LVT
JESD-30 Code R-PDSO-G20 R-PBGA-B56
JESD-609 Code e4 e0
Length 12.8 mm 7 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 2 4
Number of Ports 2 2
Number of Terminals 20 56
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Characteristics OPEN-COLLECTOR 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 18.5 ns 4 ns
Seated Height-Max 2.65 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology TTL BICMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.5 mm 4.5 mm
Base Number Matches 2 2
Manufacturer Package Code SOT702-1
HTS Code 8542.39.00.01
Control Type ENABLE LOW
Load Capacitance (CL) 50 pF
Max I(ol) 0.064 A
Package Equivalence Code BGA56,6X10,25
Packing Method TR
Prop. Delay@Nom-Sup 3.2 ns
Qualification Status Not Qualified

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Compare 74LVT16244BEV,157 with alternatives