SN74AUP1G00DCKR vs 74AUP1G00GW,125 feature comparison

SN74AUP1G00DCKR Rochester Electronics LLC

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74AUP1G00GW,125 NXP Semiconductors

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Pbfree Code No
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description GREEN, PLASTIC, SC-70, 5 PIN 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
Pin Count 5 5
Reach Compliance Code unknown compliant
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e4 e3
Length 2 mm 2.05 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 27.1 ns 24.9 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Manufacturer Package Code SOT353-1
HTS Code 8542.39.00.01
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code TSSOP5/6,.08
Prop. Delay@Nom-Sup 24.9 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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