SN74AUP1G02YFPR
vs
NLU1GT86CMX1TCG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
|
| Part Package Code |
BGA
|
|
| Package Description |
GREEN, DSBGA-6
|
|
| Pin Count |
6
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Family |
AUP/ULP/V
|
|
| JESD-30 Code |
R-PBGA-B6
|
|
| JESD-609 Code |
e1
|
|
| Length |
1.4 mm
|
|
| Load Capacitance (CL) |
30 pF
|
|
| Logic IC Type |
NOR GATE
|
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Inputs |
2
|
|
| Number of Terminals |
6
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA6,2X3,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
0.0009 mA
|
|
| Prop. Delay@Nom-Sup |
26.2 ns
|
|
| Propagation Delay (tpd) |
26.2 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
0.5 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
|
| Supply Voltage-Nom (Vsup) |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
0.9 mm
|
|
| Base Number Matches |
1
|
|
|
|
|
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