SN74AUP1G08DCKRE4 vs 74AUP1G08GM feature comparison

SN74AUP1G08DCKRE4 Texas Instruments

Buy Now Datasheet

74AUP1G08GM Philips Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC PHILIPS SEMICONDUCTORS
Part Package Code SOIC
Package Description TSSOP, TSSOP5/6,.08
Pin Count 5
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family AUP/ULP/V
JESD-30 Code R-PDSO-G5 R-PDSO-N6
JESD-609 Code e4 e0
Length 2 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A 0.0017 A
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 2
Number of Terminals 5 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SON
Package Equivalence Code TSSOP5/6,.08 SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.0009 mA
Prop. Delay@Nom-Sup 25.5 ns
Propagation Delay (tpd) 25.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm
Base Number Matches 1 3

Compare SN74AUP1G08DCKRE4 with alternatives