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SN74AUP1G125DCK vs 74AUP1G126GM,132 feature comparison

SN74AUP1G125DCK Texas Instruments

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74AUP1G126GM,132 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Package Description TSSOP, TSSOP5/6,.08 VSON, SOLCC6,.04,20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 R-PDSO-N6
Length 2 mm 1.45 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 5 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Equivalence Code TSSOP5/6,.08 SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Propagation Delay (tpd) 21.4 ns 24 ns
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1 mm
Base Number Matches 1 2
Rohs Code Yes
Part Package Code SON
Pin Count 6
Manufacturer Package Code SOT886
Control Type ENABLE HIGH
JESD-609 Code e3
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 24 ns
Qualification Status Not Qualified
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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Compare 74AUP1G126GM,132 with alternatives