SN74AUP1T97DBVTG4
vs
SN74AUP1T97DCKRG4
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOT-23
|
SOIC
|
| Package Description |
LSSOP, TSOP6,.11,37
|
TSSOP,
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e4
|
e4
|
| Length |
2.9 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
TSSOP
|
| Package Equivalence Code |
TSOP6,.11,37
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.45 mm
|
1.1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.6 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Number of Bits |
|
1
|
| Number of Channels |
|
1
|
| Output Characteristics |
|
PUSH-PULL
|
| Supply Current-Max |
|
0.0009 mA
|
|
|
|
Compare SN74AUP1T97DBVTG4 with alternatives
Compare SN74AUP1T97DCKRG4 with alternatives