SN74AVC8T245DGVR
vs
74AVCH8T245BQ,115
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
QFN
|
| Package Description |
GREEN, PLASTIC, TVSOP-24
|
3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
AVC
|
AVC
|
| JESD-30 Code |
R-PDSO-G24
|
R-PQCC-N24
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
5.5 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
6.8 ns
|
9.9 ns
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
4.4 mm
|
3.5 mm
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
SOT815-1
|
|
|
|
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